发明授权
- 专利标题: Printed circuit board and manufacturing method thereof
- 专利标题(中): 印刷电路板及其制造方法
-
申请号: US11645710申请日: 2006-12-27
-
公开(公告)号: US07473099B2公开(公告)日: 2009-01-06
- 发明人: Keun-Ho Kim , Dek-Gin Yang , Jong-Guk Kim , Il-Kyoon Jeon , Eung-Suek Lee
- 申请人: Keun-Ho Kim , Dek-Gin Yang , Jong-Guk Kim , Il-Kyoon Jeon , Eung-Suek Lee
- 申请人地址: KR Suwon
- 专利权人: Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人: Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人地址: KR Suwon
- 优先权: KR10-2006-0063634 20060706
- 主分类号: H01R12/00
- IPC分类号: H01R12/00
摘要:
A printed circuit board and manufacturing method thereof are disclosed. A printed circuit board composed of an insulation substrate, which includes an insulation layer, a circuit pattern formed on one side of the insulation layer, and an interlayer passage joined to the insulation layer and configured to electrically connect with the circuit pattern, and a heat-release layer, which is stacked on the other side of the insulation layer to be stacked on the insulation substrate, can provide a high heat-releasing effect and high bending strength, by means of inner layers or ground layers formed by the heat-release layers.
公开/授权文献
- US20080009146A1 Printed circuit board and manufacturing method thereof 公开/授权日:2008-01-10