发明授权
- 专利标题： Integrated circuit package with elevated edge leadframe
- 专利标题（中）： 集成电路封装，带有高架边缘引线框架
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申请号： US11610304申请日： 2006-12-13
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公开(公告)号： US07479409B2公开(公告)日： 2009-01-20
- 发明人: Zigmund Ramirez Camacho , Henry D. Bathan , Jose Alvin Caparas , Jeffrey D. Punzalan
- 申请人： Zigmund Ramirez Camacho , Henry D. Bathan , Jose Alvin Caparas , Jeffrey D. Punzalan
- 申请人地址： SG Singapore
- 专利权人： Stats Chippac LTD.
- 当前专利权人： Stats Chippac LTD.
- 当前专利权人地址： SG Singapore
- 代理商 Mikio Ishimaru
- 主分类号： H01L21/00
- IPC分类号： H01L21/00
摘要：
An integrated circuit package system includes an elevated edge leadframe array, isolating leadframes of the elevated edge leadframe array, validating integrated circuit die attached to the leadframes, and forming integrated circuit packages including the integrated circuit die.
公开/授权文献
- US20080142934A1 INTEGRATED CIRCUIT PACKAGE WITH ELEVATED EDGE LEADFRAME 公开/授权日：2008-06-19
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