Invention Grant
US07479685B2 Electronic device on substrate with cavity and mitigated parasitic leakage path
失效
衬底上的电子器件具有空腔和减轻的寄生泄漏路径
- Patent Title: Electronic device on substrate with cavity and mitigated parasitic leakage path
- Patent Title (中): 衬底上的电子器件具有空腔和减轻的寄生泄漏路径
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Application No.: US11373434Application Date: 2006-03-10
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Publication No.: US07479685B2Publication Date: 2009-01-20
- Inventor: R. Shane Fazzio , Richard C. Ruby , Christopher P. Wade , Michael Louis Frank , David A. Feld
- Applicant: R. Shane Fazzio , Richard C. Ruby , Christopher P. Wade , Michael Louis Frank , David A. Feld
- Applicant Address: SG Singapore
- Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.
- Current Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.
- Current Assignee Address: SG Singapore
- Main IPC: H01L29/78
- IPC: H01L29/78

Abstract:
An electronic device. The electronic device includes a first electrode and a coating layer. The electronic device is fabricated on a substrate; the substrate has a cavity created in a top surface of the substrate; and the first electrode is electrically coupled to the substrate. The coating layer coats at least part of a substrate surface in the cavity, and the presence of the coating layer results in a mitigation of at least one parasitic leakage path between the first electrode and an additional electrode fabricated on the substrate.
Public/Granted literature
- US20070236310A1 Electronic device on substrate with cavity and mitigated parasitic leakage path Public/Granted day:2007-10-11
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