A wireless dynamic operating condition system is described that includes one or more wireless monitors located at a monitoring point in an instrumented machine system. The wireless monitors may be configured as a modular base with modular power supplies that can be attached to the base. The base may include integrated sensors or additional sensors may be tethered to the base. The resulting modular system allows for points to be monitored on the machine system for dynamic operating conditions that are difficult to access or are less critical than wired monitoring points. Calculations may be carried out based upon the sensed data either within the monitoring modules themselves or within specific modules that are so equipped.