Invention Grant
- Patent Title: Apparatus for feeding components from packaged component band
- Patent Title (中): 用于从包装的组件带供给组件的装置
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Application No.: US11367095Application Date: 2006-03-03
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Publication No.: US07480986B2Publication Date: 2009-01-27
- Inventor: Zhao-Lue Zeng , Hsuan-Jen Kung , Yuan-Chiu Lin
- Applicant: Zhao-Lue Zeng , Hsuan-Jen Kung , Yuan-Chiu Lin
- Applicant Address: CN Bao-an District, Shenzhen, Quangdong Province TW Tu-Cheng, Taipei Hsien
- Assignee: Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Bao-an District, Shenzhen, Quangdong Province TW Tu-Cheng, Taipei Hsien
- Agency: Morris Manning Martin LLP
- Agent Tim Tingkang Xia, Esq.
- Priority: CN200520055502U 20050304; CN200520145515U 20051203
- Main IPC: H05K3/30
- IPC: H05K3/30

Abstract:
An apparatus for feeding components from a packaged component band includes a stand defining a platform allowing the packaged component band passing therealong, a first guiding unit installable to the stand beside the platform, and a second guiding unit installable to the stand next to the another end of the platform. The first guiding unit is urged to remove a package from the packaged component band to expose components at one end of the platform and guides the package toward another end of the platform. The second guiding unit accepts the package from the first guiding unit and accelerates movement of the package passing therethrough. The second guiding unit includes a first friction pulley urged to rotate, and a second friction pulley rotatably movable together with the first friction pulley and engagable with the package when the package engagably passes therethrough.
Public/Granted literature
- US20060196044A1 Package removal device Public/Granted day:2006-09-07
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