发明授权
US07481162B2 Photogravure pressure and method for manufacturing multilayer ceramic electronic component
有权
照相凹版印刷压力及制造多层陶瓷电子元器件的方法
- 专利标题: Photogravure pressure and method for manufacturing multilayer ceramic electronic component
- 专利标题(中): 照相凹版印刷压力及制造多层陶瓷电子元器件的方法
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申请号: US11619249申请日: 2007-01-03
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公开(公告)号: US07481162B2公开(公告)日: 2009-01-27
- 发明人: Hiroyoshi Takashima , Akira Hashimoto , Kazuhiro Tabata , Yoshihiro Kanayama , Takashige Tanabe
- 申请人: Hiroyoshi Takashima , Akira Hashimoto , Kazuhiro Tabata , Yoshihiro Kanayama , Takashige Tanabe
- 申请人地址: JP Kyoto
- 专利权人: Murata Manufacturing Co., Ltd.
- 当前专利权人: Murata Manufacturing Co., Ltd.
- 当前专利权人地址: JP Kyoto
- 代理机构: Keating & Bennett, LLP
- 优先权: JP2004-201557 20040708
- 主分类号: B41F9/00
- IPC分类号: B41F9/00 ; B41N1/00
摘要:
In a print area provided on a peripheral surface of a gravure roll, a plurality of cells are defined by printing-direction walls and perpendicular walls, and each perpendicular wall has a plurality of cuts. In a center portion of the print area, most intersections of the printing-direction walls and the perpendicular walls are defined by T-shaped intersections where the perpendicular walls do not cross the printing-direction walls, but meet the printing-direction walls in a T-shaped arrangement. Preferably, round chamfers are provided at corners where a portion of each printing-direction wall and a portion of each perpendicular wall intersect, and at leading ends of the perpendicular walls pointing toward the cuts.
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