发明授权
US07481162B2 Photogravure pressure and method for manufacturing multilayer ceramic electronic component 有权
照相凹版印刷压力及制造多层陶瓷电子元器件的方法

Photogravure pressure and method for manufacturing multilayer ceramic electronic component
摘要:
In a print area provided on a peripheral surface of a gravure roll, a plurality of cells are defined by printing-direction walls and perpendicular walls, and each perpendicular wall has a plurality of cuts. In a center portion of the print area, most intersections of the printing-direction walls and the perpendicular walls are defined by T-shaped intersections where the perpendicular walls do not cross the printing-direction walls, but meet the printing-direction walls in a T-shaped arrangement. Preferably, round chamfers are provided at corners where a portion of each printing-direction wall and a portion of each perpendicular wall intersect, and at leading ends of the perpendicular walls pointing toward the cuts.
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