发明授权
- 专利标题： Stack MCP and manufacturing method thereof
- 专利标题（中）： 堆叠MCP及其制造方法
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申请号： US11826286申请日： 2007-07-13
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公开(公告)号： US07482695B2公开(公告)日： 2009-01-27
- 发明人: Shinya Takyu , Kazuhiro Iizuka , Mika Kiritani
- 申请人： Shinya Takyu , Kazuhiro Iizuka , Mika Kiritani
- 申请人地址： JP Tokyo
- 专利权人： Kabushiki Kaisha Toshiba
- 当前专利权人： Kabushiki Kaisha Toshiba
- 当前专利权人地址： JP Tokyo
- 代理机构： Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P.
- 优先权： JP2004-036446 20040213
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L23/52 ; H01L29/40
摘要：
A semiconductor chip having an adhesive layer previously formed on an element forming surface thereof and having a bump exposed from the surface of the adhesive layer is wire-bonded to a printed circuit board. Another semiconductor chip is stacked on the above semiconductor chip with the adhesive layer disposed therebetween and is wire-bonded to the printed circuit board by wire bonding. Likewise, at least one semiconductor chip is sequentially stacked on the thus attained semiconductor structure to form a stack MCP.
公开/授权文献
- US20070262445A1 Stack MCP and manufacturing method thereof 公开/授权日：2007-11-15
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