Printed circuit board including embedded chips and method of fabricating the same

Invention Grant

US07485569B2 Printed circuit board including embedded chips and method of fabricating the same 失效

Title translation: 包括嵌入式芯片的印刷电路板及其制造方法

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Patent Title: Printed circuit board including embedded chips and method of fabricating the same
Patent Title (中): 包括嵌入式芯片的印刷电路板及其制造方法
Application No.: US11137345

Application Date: 2005-05-24
Publication No.: US07485569B2

Publication Date: 2009-02-03
Inventor: Chang Sup Ryu , Doo Hwan Lee , Jin Yong Ahn , Myung Sam Kang , Suk Hyeon Cho
Applicant: Chang Sup Ryu , Doo Hwan Lee , Jin Yong Ahn , Myung Sam Kang , Suk Hyeon Cho
Applicant Address: KR Kyunggi-do. Korea
Assignee: Samsung Electro-Mechanics Co., Ltd.
Current Assignee: Samsung Electro-Mechanics Co., Ltd.
Current Assignee Address: KR Kyunggi-do. Korea
Agency: Darby & Darby P.c.
Priority: KR10-2004-0116805 20041230
Main IPC: H01L21/4763
IPC: H01L21/4763

Printed circuit board including embedded chips and method of fabricating the same

Abstract:

A printed circuit board having embedded chips, composed of a central layer having an embedded chip, an insulating layer formed on one surface or both surfaces of the central layer and having a via hole filled with conductive ink, and a circuit layer formed on the insulating layer and having a via hole and a circuit pattern electrically connected to the chip of the central layer through the via hole of the insulating layer. In addition, a method of fabricating a printed circuit board including embedded chips is provided.

Abstract(Chinese):

一种具有嵌入式芯片的印刷电路板，由具有嵌入式芯片的中心层，形成在中心层的一个表面或两个表面上的绝缘层，并且具有填充有导电油墨的通孔，以及形成在绝缘体上的电路层并且具有通孔和通过绝缘层的通孔与中心层的芯片电连接的电路图案。此外，提供了一种制造包括嵌入式芯片的印刷电路板的方法。

Public/Granted literature

US20060157832A1 Printed circuit board including embedded chips and method of fabricating the same Public/Granted day:2006-07-20

Information query

Espacenet

IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L21/00	专门适用于制造或处理半导体或固体器件或其部件的方法或设备
H01L21/02	.半导体器件或其部件的制造或处理
H01L21/04	..至少具有一个跃变势垒或表面势垒的器件，例如PN结、耗尽层、载体集结层
H01L21/34	...具有H01L21/06，H01L21/16及H01L21/18各组不包含的或有或无杂质，例如掺杂材料的半导体的器件
H01L21/46	....用H01L21/36至H01L21/428各组不包含的方法或设备处理半导体材料的（在半导体材料上制作电极的入H01L21/44）
H01L21/461	.....改变半导体材料的表面物理特性或形状的，例如腐蚀、抛光、切割
H01L21/4763	......非绝缘层的沉积，例如绝缘层上的导电层、电阻层；这些层的后处理（电极的制造入H01L21/28）