Invention Grant
- Patent Title: Overmolding system
- Patent Title (中): 包覆成型系统
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Application No.: US11550859Application Date: 2006-10-19
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Publication No.: US07487007B2Publication Date: 2009-02-03
- Inventor: Jeffrey Douglas MacDonald , Alireza Mortazavi , Robin Alexander Arnott
- Applicant: Jeffrey Douglas MacDonald , Alireza Mortazavi , Robin Alexander Arnott
- Applicant Address: CA Bolton, Ontario
- Assignee: Husky Injection Molding Systems Ltd.
- Current Assignee: Husky Injection Molding Systems Ltd.
- Current Assignee Address: CA Bolton, Ontario
- Main IPC: B29C45/00
- IPC: B29C45/00
Abstract:
Disclosed is (i) an overmolding system, (ii) a method of an overmolding system, (iii) an article of manufacture for directing a data processing system to control a molding system, and (iv) an article manufactured by an overmolding system.
Public/Granted literature
- US20080154418A1 Overmolding System Public/Granted day:2008-06-26
Information query
