Invention Grant
- Patent Title: Substrate bonding apparatus for liquid crystal display device and method for fabricating the same
- Patent Title (中): 液晶显示装置用基板接合装置及其制造方法
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Application No.: US10917342Application Date: 2004-08-13
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Publication No.: US07487812B2Publication Date: 2009-02-10
- Inventor: Sang Seok Lee , Sang Ho Park
- Applicant: Sang Seok Lee , Sang Ho Park
- Applicant Address: KR Seoul
- Assignee: LG Display Co., Ltd.
- Current Assignee: LG Display Co., Ltd.
- Current Assignee Address: KR Seoul
- Agency: McKenna Long & Aldridge LLP
- Priority: KR10-2002-15643 20020322; KR10-2002-15966 20020325
- Main IPC: B32B37/00
- IPC: B32B37/00
Abstract:
A substrate bonding apparatus includes a bonding chamber, lower and upper stages positioned at lower and upper spaces at an interior of the bonding chamber, respectively, the lower stage including a first receiving part, a first lifting system having a first support part for supporting a first substrate, the first receiving part receiving the first support part within the lower stage, and a blowing system formed in the first support part to blow air through the first support part.
Public/Granted literature
- US20050011606A1 Substrate bonding apparatus for liquid crystal display device and method for fabricating the same Public/Granted day:2005-01-20
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