Invention Grant
- Patent Title: Land structure, printed wiring board, and electronic device
- Patent Title (中): 土地结构，印刷线路板和电子设备
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Application No.: US11270102Application Date: 2005-11-09
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Publication No.: US07488898B2Publication Date: 2009-02-10
- Inventor: Koji Otani
- Applicant: Koji Otani
- Applicant Address: JP Tokyo
- Assignee: Mitsumi Electric Co., Ltd.
- Current Assignee: Mitsumi Electric Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Ladas & Parry LLP
- Priority: JP2005-095084 20050329
- Main IPC: H01R12/04
- IPC: H01R12/04 ; H05K1/11
Abstract:
A land part where a connection part of an electronic part is soldered, includes a head end part. The head end part includes an inclination part. The inclination part may be formed by an end side. The end side may make a designated angle from an end line of the connection part of the electronic part.
Public/Granted literature
- US20060219430A1 Land structure, printed wiring board, and electronic device Public/Granted day:2006-10-05
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