Invention Grant
- Patent Title: Shredder with stack thickness gauge
- Patent Title (中): 粉碎机堆叠厚度计
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Application No.: US11324782Application Date: 2006-01-04
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Publication No.: US07490786B2Publication Date: 2009-02-17
- Inventor: Tai Hoon Kim Matlin , Devin Lee Moore , Matthew Luis Rivera , Nheeda C. Enriquez
- Applicant: Tai Hoon Kim Matlin , Devin Lee Moore , Matthew Luis Rivera , Nheeda C. Enriquez
- Applicant Address: US IL Itasca
- Assignee: Fellowes, Inc.
- Current Assignee: Fellowes, Inc.
- Current Assignee Address: US IL Itasca
- Agency: Pillsbury Winthrop Shaw Pittman LLP
- Main IPC: B02C25/00
- IPC: B02C25/00
Abstract:
The present invention relates to a shredder with a stack thickness gauge.
Public/Granted literature
- US20070007373A1 Shredder with stack thickness gauge Public/Granted day:2007-01-11
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