Invention Grant
- Patent Title: Substrate processing apparatus
- Patent Title (中): 基板加工装置
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Application No.: US10590521Application Date: 2005-05-12
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Publication No.: US07491662B2Publication Date: 2009-02-17
- Inventor: Satoshi Takano
- Applicant: Satoshi Takano
- Applicant Address: JP Tokyo
- Assignee: Hitachi Kokusai Electric Inc.
- Current Assignee: Hitachi Kokusai Electric Inc.
- Current Assignee Address: JP Tokyo
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP2004-146113 20040517
- International Application: PCT/JP2005/009107 WO 20050512
- International Announcement: WO2005/112108 WO 20051124
- Main IPC: H01L21/00
- IPC: H01L21/00

Abstract:
Substrate processing with return processing is carried out efficiently by a substrate processing apparatus that continuously processes a plurality of substrates. The apparatus is equipped with a conveyor chamber constituting a substrate convey space, a plurality of process chambers in which substrate processing is carried out, a substrate conveying device provided in the conveyor chamber having a function of conveying substrates, and a substrate convey control device that controls the process of substrate conveyance by the substrate conveying device so that in a case in which after a substrate is continuously processed by two or more process chambers, the substrate is re-conveyed from the last process chamber to any of the two or more process chambers other than the last and return processing is implemented. In the re-conveyance, the substrate is conveyed to any of the process chambers after being temporarily retracted to a place other than a process chamber.
Public/Granted literature
- US20070184636A1 Substrate processing apparatus Public/Granted day:2007-08-09
Information query
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