发明授权
- 专利标题: Advanced activation approach for MOS devices
- 专利标题(中): MOS器件的高级激活方法
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申请号: US11648371申请日: 2006-12-29
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公开(公告)号: US07494857B2公开(公告)日: 2009-02-24
- 发明人: Chien-Hao Chen , Tze-Liang Lee , Shih-Chang Chen , Keh-Chiang Ku , Chun-Feng Nieh , Li-Ting Wang , Hsun Chang
- 申请人: Chien-Hao Chen , Tze-Liang Lee , Shih-Chang Chen , Keh-Chiang Ku , Chun-Feng Nieh , Li-Ting Wang , Hsun Chang
- 申请人地址: TW Hsin-Chu
- 专利权人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址: TW Hsin-Chu
- 代理机构: Slater & Matsil, L.L.P.
- 主分类号: H01L21/336
- IPC分类号: H01L21/336 ; H01L21/461
摘要:
A method of forming a semiconductor structure includes providing a semiconductor substrate; forming a gate dielectric over the semiconductor substrate; forming a gate electrode on the gate dielectric; forming a source/drain region adjacent the gate dielectric and the gate electrode; forming an absorption-capping layer over the source/drain region and the gate electrode; performing an activation by applying a high-energy light to the absorption-capping layer; and removing the absorption-capping layer.
公开/授权文献
- US20080160709A1 Advanced activation approach for MOS devices 公开/授权日:2008-07-03
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