Invention Grant
- Patent Title: Micromechanical component
- Patent Title (中): 微机械部件
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Application No.: US11493702Application Date: 2006-07-24
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Publication No.: US07495328B2Publication Date: 2009-02-24
- Inventor: Frank Reichenbach , Freider Haag , Arnd Kaelberer
- Applicant: Frank Reichenbach , Freider Haag , Arnd Kaelberer
- Applicant Address: DE Stuttgart
- Assignee: Robert Bosch GmbH
- Current Assignee: Robert Bosch GmbH
- Current Assignee Address: DE Stuttgart
- Agency: Kenyon & Kenyon LLP
- Priority: DE102005038755 20050817
- Main IPC: H01L23/22
- IPC: H01L23/22 ; H01L23/24
Abstract:
A micromechanical component has a structure such that a material flow is guided from at least one preferred direction for the purpose of uniformly enveloping the micromechanical component.
Public/Granted literature
- US20070040230A1 Micromechanical component Public/Granted day:2007-02-22
Information query
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