发明授权
- 专利标题: Wafer dividing apparatus
- 专利标题(中): 晶圆分割装置
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申请号: US11249494申请日: 2005-10-14
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公开(公告)号: US07497213B2公开(公告)日: 2009-03-03
- 发明人: Yusuke Nagai
- 申请人: Yusuke Nagai
- 申请人地址: JP Tokyo
- 专利权人: Disco Corporation
- 当前专利权人: Disco Corporation
- 当前专利权人地址: JP Tokyo
- 代理机构: Smith, Gambrell & Russell, LLP
- 优先权: JP2004-306041 20041020
- 主分类号: B28D1/32
- IPC分类号: B28D1/32
摘要:
A wafer dividing apparatus for dividing a wafer whose strength is reduced along a plurality of dividing lines, along the dividing lines, which comprises a tape holding means for holding a protective tape affixed to one side of the wafer; and wafer dividing means, each comprising a plurality of tension application means comprising a first suction-holding member and a second suction-holding member for suction-holding the wafer held on the tape holding means through the protective tape on both sides of a dividing line, and moving means for moving the first suction-holding members and the second suction-holding members in such directions that they separate from each other.
公开/授权文献
- US20060081574A1 Wafer dividing apparatus 公开/授权日:2006-04-20