Invention Grant
- Patent Title: Method for die attaching
- Patent Title (中): 贴片方法
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Application No.: US11293992Application Date: 2005-12-05
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Publication No.: US07498202B2Publication Date: 2009-03-03
- Inventor: Hung-Ta Hsu , Tzu-Bin Lin , Ya-Ling Huang , Ya-Yu Hsieh
- Applicant: Hung-Ta Hsu , Tzu-Bin Lin , Ya-Ling Huang , Ya-Yu Hsieh
- Applicant Address: TW Kaohsiung
- Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee Address: TW Kaohsiung
- Agency: Thomas, Kayden, Horstemeyer & Risley
- Priority: TW93137655A 20041206
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
A method for die attaching is disclosed. At first, at least one die and a die-attach preform are separately provided. The die-attach preform is picked and placed upon a die carrier. Then, the die is picked and placed upon the die-attach preform. The die and the die carrier are heated and clipped, so that the die-attach preform can adhere the die and the die carrier at the same time.
Public/Granted literature
- US20060121644A1 Method for die attaching Public/Granted day:2006-06-08
Information query
IPC分类:
