Invention Grant
- Patent Title: High-voltage power semiconductor device
- Patent Title (中): 高压功率半导体器件
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Application No.: US11338007Application Date: 2006-01-23
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Publication No.: US07498633B2Publication Date: 2009-03-03
- Inventor: James A. Cooper , Asmita Saha
- Applicant: James A. Cooper , Asmita Saha
- Applicant Address: US IN West Lafayette
- Assignee: Purdue Research Foundation
- Current Assignee: Purdue Research Foundation
- Current Assignee Address: US IN West Lafayette
- Agency: Barnes & Thornburg LLP
- Main IPC: H01L29/94
- IPC: H01L29/94

Abstract:
A semiconductor device, such as a metal-oxide semiconductor field-effect transistor, includes a semiconductor substrate, a drift layer formed on the substrate, a first and a second source region, and a JFET region defined between the first and the second source regions. The JFET region may have a short width and/or a higher concentration of impurities than the drift layer. The semiconductor device may also include a current spreading layer formed on the drift layer. The current spreading layer may also have a higher concentration of impurities than the drift layer.
Public/Granted literature
- US20060192256A1 High-voltage power semiconductor device Public/Granted day:2006-08-31
Information query
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