In some embodiments, a voltage grading and shielding method for a high voltage component, is provided. In some embodiments, the method includes configuring at least one first track constructed of a metal or an alloy, at a first location predetermined from the mounting position of the high voltage component, and at least one second track constructed of a metal or an alloy thereof, at a second location predetermined along the length of the high voltage component. In some embodiments, the configured at least one first track substantially reduces the stray capacitance effect and the at least one second track produces a substantially linear voltage distribution along the length of the high voltage component.