发明授权
- 专利标题: Multi-chip module with power system
- 专利标题(中): 带电源系统的多芯片模块
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申请号: US11968520申请日: 2008-01-02
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公开(公告)号: US07499281B2公开(公告)日: 2009-03-03
- 发明人: Shaun L. Harris , Steven A. Belson , Eric C. Peterson , Gary W. Williams , Christian L. Belady
- 申请人: Shaun L. Harris , Steven A. Belson , Eric C. Peterson , Gary W. Williams , Christian L. Belady
- 申请人地址: US TX Houston
- 专利权人: Hewlett-Packard Development Company, L.P.
- 当前专利权人: Hewlett-Packard Development Company, L.P.
- 当前专利权人地址: US TX Houston
- 主分类号: H05K7/20
- IPC分类号: H05K7/20 ; F28F7/00
摘要:
Embodiments include apparatus, methods, and systems having a multi-chip module with a power system. An exemplary electronic module includes a printed circuit board (PCB) having a memory and plural processors. A power system couples to and is disposed vertically above the PCB. A thermal dissipation device is disposed between the power system and the PCB for dissipating heat, via a direct heat exchange, from both the power system and the plural processors.
公开/授权文献
- US20080101025A1 Multi-chip Module with Power System 公开/授权日:2008-05-01