Invention Grant
US07501656B2 Light emitting diode package with diffuser and method of manufacturing the same
有权
具有扩散器的发光二极管封装及其制造方法
- Patent Title: Light emitting diode package with diffuser and method of manufacturing the same
- Patent Title (中): 具有扩散器的发光二极管封装及其制造方法
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Application No.: US11491947Application Date: 2006-07-25
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Publication No.: US07501656B2Publication Date: 2009-03-10
- Inventor: Seong Yeon Han , Seon Goo Lee , Chang Ho Song , Jung Kyu Park , Young Sam Park , Kyung Taeg Han
- Applicant: Seong Yeon Han , Seon Goo Lee , Chang Ho Song , Jung Kyu Park , Young Sam Park , Kyung Taeg Han
- Applicant Address: KR Kyungki-do
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Kyungki-do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2005-0067859 20050726
- Main IPC: H01L27/15
- IPC: H01L27/15 ; H01L31/12 ; H01L33/00

Abstract:
The invention relates to an LED package for facilitating color mixing using a diffuser and a manufacturing method of the same. The LED package includes a substrate with an electrode formed thereon, and an LED chip mounted on the substrate. The LED package also includes an encapsulant applied around the light emitting diode chip, containing a diffuser. The LED package further includes a lens part disposed on the light emitting diode chip and the encapsulant to radiate light in a wide angle. The LED package allows light from the light emitting diode chip to be emitted out of the package without distortion. The invention allows light to exit through the encapsulant containing the diffuser and the lens part, achieving uniform diffusion and emission of light from the LED chip, thereby increasing a radiating angle and obtaining a uniform light source.
Public/Granted literature
- US20070045644A1 Light emitting diode package with diffuser and method of manufacturing the same Public/Granted day:2007-03-01
Information query
IPC分类: