发明授权
US07501704B2 Integrated circuit chip with external pads and process for fabricating such a chip
有权
具有外部焊盘的集成电路芯片和用于制造这种芯片的工艺
- 专利标题： Integrated circuit chip with external pads and process for fabricating such a chip
- 专利标题（中）： 具有外部焊盘的集成电路芯片和用于制造这种芯片的工艺
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申请号： US11607827申请日： 2006-11-30
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公开(公告)号： US07501704B2公开(公告)日： 2009-03-10
- 发明人: Sébastien Marsanne , Olivier Le Briz
- 申请人： Sébastien Marsanne , Olivier Le Briz
- 申请人地址： FR Montrouge
- 专利权人： STMicroelectronics S.A.
- 当前专利权人： STMicroelectronics S.A.
- 当前专利权人地址： FR Montrouge
- 代理机构： Gardere Wynne Sewell LLP
- 优先权： FR0512500 20051209
- 主分类号： H01L23/48
- IPC分类号： H01L23/48
摘要：
An integrated circuit chip has a dielectric surface layer and, below this layer, internal pads. The chip is fabricated by producing multiplicities of vias made of an electrically conducting material which pass through said surface layer and are positioned respectively above the internal pads. Projecting external contact pads are formed on the surface layer and connected respectively to the multiplicities of vias.