发明授权
- 专利标题： Interposer and test assembly for testing electronic devices
- 专利标题（中）： 用于测试电子设备的插件和测试组件
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申请号： US11607973申请日： 2006-12-04
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公开(公告)号： US07501839B2公开(公告)日： 2009-03-10
- 发明人: Benson Chan , Frank D. Egitto , Voya R. Markovich
- 申请人： Benson Chan , Frank D. Egitto , Voya R. Markovich
- 申请人地址： US NY Endicott
- 专利权人： Endicott Interconnect Technologies, Inc.
- 当前专利权人： Endicott Interconnect Technologies, Inc.
- 当前专利权人地址： US NY Endicott
- 代理机构： Hinman, Howard & Kattell
- 代理商 Mark Levy; Lawrence Fraley
- 主分类号： G01R31/02
- IPC分类号： G01R31/02
摘要：
A test apparatus which uses a pair of substrates and housing to interconnect a host substrate (e.g., PCB) to an electronic device (e.g., semiconductor chip) to accomplish testing of the device. The apparatus includes a housing designed for being positioned on the PCB and have one of the substrates oriented therein during device engagement. The engaging contacts of the upper (second) substrate are sculpted to assure effective chip connection.
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