Invention Grant
US07503767B2 Method and apparatus for compliantly connecting stack of high-density electronic modules in harsh environments
有权
用于在恶劣环境中顺应地连接高密度电子模块堆叠的方法和装置
- Patent Title: Method and apparatus for compliantly connecting stack of high-density electronic modules in harsh environments
- Patent Title (中): 用于在恶劣环境中顺应地连接高密度电子模块堆叠的方法和装置
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Application No.: US11496467Application Date: 2006-08-01
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Publication No.: US07503767B2Publication Date: 2009-03-17
- Inventor: Deepak Pai
- Applicant: Deepak Pai
- Applicant Address: US VA Fairfax
- Assignee: General Dynamics Advanced Information Systems, Inc.
- Current Assignee: General Dynamics Advanced Information Systems, Inc.
- Current Assignee Address: US VA Fairfax
- Agency: Steptoe & Johnson LLP
- Main IPC: H01R12/00
- IPC: H01R12/00
Abstract:
A system for connecting circuit boards is provided. A plurality of overlapping spaced apart circuit boards have a plurality of conductive pins passing through holes in the circuit boards. A connector includes a flexible sheet insulator and a plurality of conductive surfaces separated and supported by the flexible insulator. At least one of the conductive surfaces has a hole there through and a bent compliant lead extending there from. The hole engages one of the pins, and the complaint lead connects to one of the circuit boards.
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