Invention Grant
US07504706B2 Packaging having an array of embedded capacitors for power delivery and decoupling in the mid-frequency range and methods of forming thereof 失效
封装具有用于在中频范围内进行功率输送和去耦的嵌入式电容器阵列及其形成方法

Packaging having an array of embedded capacitors for power delivery and decoupling in the mid-frequency range and methods of forming thereof
Abstract:
One embodiment of the present invention provides a device for providing a low noise power supply package to an IC in the mid-frequency range of 1 MHz to 3 GHz including installing in said package an array of embedded discrete ceramic capacitors, and optionally planar capacitor layers. A further embodiment provides a device for providing a low noise power supply package to an IC in the mid-frequency range of 1 MHz to 3 GHz including an array of embedded discrete ceramic capacitors with different resonance frequencies, arranged in such a way that the capacitor array's impedance vs frequency curve in the critical mid-frequency range yields impedance values at or below a targeted impedance value.
Information query
Patent Agency Ranking
0/0