Invention Grant
US07504706B2 Packaging having an array of embedded capacitors for power delivery and decoupling in the mid-frequency range and methods of forming thereof
失效
封装具有用于在中频范围内进行功率输送和去耦的嵌入式电容器阵列及其形成方法
- Patent Title: Packaging having an array of embedded capacitors for power delivery and decoupling in the mid-frequency range and methods of forming thereof
- Patent Title (中): 封装具有用于在中频范围内进行功率输送和去耦的嵌入式电容器阵列及其形成方法
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Application No.: US11514097Application Date: 2006-08-31
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Publication No.: US07504706B2Publication Date: 2009-03-17
- Inventor: Madhavan Swaminathan , Ege Engin , Lixi Wan , Prathap Muthana
- Applicant: Madhavan Swaminathan , Ege Engin , Lixi Wan , Prathap Muthana
- Applicant Address: US DE Wilmington
- Assignee: E. I. Du Pont De Nemours
- Current Assignee: E. I. Du Pont De Nemours
- Current Assignee Address: US DE Wilmington
- Agent Thomas W. Gorman
- Main IPC: H01L29/00
- IPC: H01L29/00

Abstract:
One embodiment of the present invention provides a device for providing a low noise power supply package to an IC in the mid-frequency range of 1 MHz to 3 GHz including installing in said package an array of embedded discrete ceramic capacitors, and optionally planar capacitor layers. A further embodiment provides a device for providing a low noise power supply package to an IC in the mid-frequency range of 1 MHz to 3 GHz including an array of embedded discrete ceramic capacitors with different resonance frequencies, arranged in such a way that the capacitor array's impedance vs frequency curve in the critical mid-frequency range yields impedance values at or below a targeted impedance value.
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