发明授权
- 专利标题: Method for charging substrate to a potential
- 专利标题(中): 将基板充电到电位的方法
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申请号: US11644591申请日: 2006-12-21
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公开(公告)号: US07507959B2公开(公告)日: 2009-03-24
- 发明人: Kirk J. Bertsche , Mark A. McCord
- 申请人: Kirk J. Bertsche , Mark A. McCord
- 申请人地址: US CA Milpitas
- 专利权人: KLA-Tencor Technologies Corporation
- 当前专利权人: KLA-Tencor Technologies Corporation
- 当前专利权人地址: US CA Milpitas
- 代理机构: Okamoto & Benedicto LLP
- 主分类号: H01J37/14
- IPC分类号: H01J37/14 ; H01J37/28
摘要:
A surface of an insulating substrate is charged to a target potential. In one embodiment, the surface is flooded with a higher-energy electron beam such that the electron yield is greater than one. Subsequently, the surface is flooded with a lower-energy electron beam such that the electron yield is less than one. In another embodiment, the substrate is provided with the surface in a state at an approximate initial potential above the target potential. The surface is then flooded with charged particle such that the charge yield of scattered particles is less than one, such that a steady state is reached at which the target potential is achieved. Another embodiment pertains to an apparatus for charging a surface of an insulating substrate to a target potential.
公开/授权文献
- US20070158589A1 Method for charging substrate to a potential 公开/授权日:2007-07-12
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