Invention Grant
- Patent Title: Heat sink
- Patent Title (中): 散热器
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Application No.: US11309532Application Date: 2006-08-18
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Publication No.: US07509997B2Publication Date: 2009-03-31
- Inventor: Yu-Chen Lin , Hong-Bo Xu
- Applicant: Yu-Chen Lin , Hong-Bo Xu
- Applicant Address: CN Shenzhen City, Guangdong Province TW Tu-Cheng, Taipei Hsien
- Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Shenzhen City, Guangdong Province TW Tu-Cheng, Taipei Hsien
- Agent Frank R. Niranjan
- Priority: CN200610060402 20060419
- Main IPC: F28F7/00
- IPC: F28F7/00 ; H05K7/20

Abstract:
A heat sink includes a first array of fins defining a plurality of first channels therebetween, a second array of fins disposed at opposite sides of the first array of fins, and a plurality of grooves extending through the first array of fins and the second array of fins. The second array of fins defines a plurality of second channels therebetween. The grooves are intersected with the first channels and the second channels. A bottom extremity of each groove has a curved shape facing upwardly and laterally. A portion of an airflow generated by a fan mounted on a top of the heat sink flows laterally and downwardly through the grooves to leave the heat sink.
Public/Granted literature
- US20070246189A1 HEAT SINK Public/Granted day:2007-10-25
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