Invention Grant
US07510425B2 Cable assembly with wire management board and method of manufacturing the same 失效
带电线管理板的电缆组件及其制造方法

Cable assembly with wire management board and method of manufacturing the same
Abstract:
A cable assembly (100) according to the present invention includes a number of wires (4) each having an inner conductor (41) and an insulation layer (42) enclosing the conductor, a PCB (2) having opposite rear and front ends, an upper surface (21) and a number of conductive pads (23) formed with said upper surface, and at least one wire management board (3, 3′) each defining opposite top and bottom surfaces and having a base mounted on said upper surface of the PCB and a number of wire management slots (32, 32′) formed integrally with said base and extending toward said conductive pads of the PCB. The inner conductors are received in the corresponding wire management slots and physically and electrically connect with the corresponding conductive pads.
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