Invention Grant
- Patent Title: Cable assembly with wire management board and method of manufacturing the same
- Patent Title (中): 带电线管理板的电缆组件及其制造方法
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Application No.: US11900386Application Date: 2007-09-11
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Publication No.: US07510425B2Publication Date: 2009-03-31
- Inventor: Peter Kuo , Zhi-Yong Li
- Applicant: Peter Kuo , Zhi-Yong Li
- Applicant Address: TW Taipei Hsien
- Assignee: Hon Hai Precision Ind. Co., Ltd.
- Current Assignee: Hon Hai Precision Ind. Co., Ltd.
- Current Assignee Address: TW Taipei Hsien
- Agent Wei Te Chung
- Priority: TW95133419A 20060911
- Main IPC: H01R12/24
- IPC: H01R12/24

Abstract:
A cable assembly (100) according to the present invention includes a number of wires (4) each having an inner conductor (41) and an insulation layer (42) enclosing the conductor, a PCB (2) having opposite rear and front ends, an upper surface (21) and a number of conductive pads (23) formed with said upper surface, and at least one wire management board (3, 3′) each defining opposite top and bottom surfaces and having a base mounted on said upper surface of the PCB and a number of wire management slots (32, 32′) formed integrally with said base and extending toward said conductive pads of the PCB. The inner conductors are received in the corresponding wire management slots and physically and electrically connect with the corresponding conductive pads.
Public/Granted literature
- US20080064254A1 Cable assembly with wire management board and method of manufacturing the same Public/Granted day:2008-03-13
Information query