A semiconductor device (10) that may have a wire bonding structure having reduced interference between bond wires and a path of a capillary has been disclosed. Semiconductor device (10) may include bond pads (12) arranged in a line along an edge of a semiconductor chip (14) and conductive fingers (16) arranged on a substrate (18). Bond pads (12) may be electrically connected to conductive fingers (16) with bond wires (20). Bond wires (20) may be divided into a first group having a relatively short length and a second group having a relatively long length. The bond wires (20) in the first group may have bonding points on a bonding pad (12) that is closer to an edge of semiconductor chip (14) than bonding points of bond wires (20) in the second group. In this way, spacing between bond wires (20) already formed and a capillary forming an adjacent bond wire may be increased.