发明授权
- 专利标题： Fluid-ejection devices and a deposition method for layers thereof
- 专利标题（中）： 流体喷射装置及其层的沉积方法
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申请号： US11345755申请日： 2006-02-02
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公开(公告)号： US07517060B2公开(公告)日： 2009-04-14
- 发明人: Ulrich E. Hess , Samson Berhane , Arjang Fartash
- 申请人： Ulrich E. Hess , Samson Berhane , Arjang Fartash
- 申请人地址： US TX Houston
- 专利权人： Hewlett-Packard Development Company, L.P.
- 当前专利权人： Hewlett-Packard Development Company, L.P.
- 当前专利权人地址： US TX Houston
- 主分类号： B41J2/05
- IPC分类号： B41J2/05
摘要：
A cavitation structure for a print head has a first dielectric layer overlying at least a first portion of a substrate. A second dielectric layer has a first portion overlying at least a second portion of the substrate and a second portion, different from the first portion of the second dielectric layer, overlying at least a portion of the first dielectric layer. A cavitation layer has a first portion in contact with the first dielectric layer and a second portion in lateral contact with the second portion of the second dielectric layer. A third dielectric layer is disposed on only the first portion of the second dielectric layer.
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