Invention Grant
- Patent Title: Micro adhesive nozzle and adhesive applying apparatus
- Patent Title (中): 微胶粘剂喷嘴和粘合剂涂布装置
-
Application No.: US11136374Application Date: 2005-05-25
-
Publication No.: US07517410B2Publication Date: 2009-04-14
- Inventor: Masaharu Ono
- Applicant: Masaharu Ono
- Applicant Address: JP Tokyo
- Assignee: Ricoh Company, Ltd.
- Current Assignee: Ricoh Company, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, P.C.
- Priority: JP2004-154468 20040525; JP2005-028453 20050204
- Main IPC: B05C3/02
- IPC: B05C3/02
Abstract:
A micro adhesive nozzle for applying adhesive on a printed circuit board is disclosed. The nozzle includes a nozzle tip portion with a protruding portion arranged at a periphery of the nozzle tip portion, an adhesive discharge opening portion formed within the periphery of the nozzle tip portion, and a gap provided between the discharge opening portion and the protruding portion.
Public/Granted literature
- US20050263250A1 Micro adhesive nozzle and adhesive applying apparatus Public/Granted day:2005-12-01
Information query
