发明授权
- 专利标题: Bulk FinFET device
- 专利标题(中): 散装FinFET器件
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申请号: US11427486申请日: 2006-06-29
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公开(公告)号: US07517764B2公开(公告)日: 2009-04-14
- 发明人: Roger Allen Booth, Jr. , William Paul Hovis , Jack Allan Mandelman
- 申请人: Roger Allen Booth, Jr. , William Paul Hovis , Jack Allan Mandelman
- 申请人地址: US NY Armonk
- 专利权人: International Business Machines Corporation
- 当前专利权人: International Business Machines Corporation
- 当前专利权人地址: US NY Armonk
- 代理机构: Schmeiser, Olsen & Watts
- 主分类号: H01L21/336
- IPC分类号: H01L21/336
摘要:
A finFET structure and a method of fabricating the finFET structure. The method includes: forming a silicon fin on a top surface of a silicon substrate; forming a gate dielectric on opposite sidewalls of the fin; forming a gate electrode over a channel region of the fin, the gate electrode in direct physical contact with the gate dielectric layer on the opposite sidewalls of the fin; forming a first source/drain in the fin on a first side of the channel region and forming a second source/drain in the fin on a second side of the channel region; removing a portion of the substrate from under at least a portion of the first and second source/drains to create a void; and filling the void with a dielectric material. The structure includes a body contact between the silicon body of the finFET and the substrate.
公开/授权文献
- US20080001187A1 Bulk FinFET Device 公开/授权日:2008-01-03