发明授权
- 专利标题： Device cooling system
- 专利标题（中）： 设备冷却系统
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申请号： US11788462申请日： 2007-04-20
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公开(公告)号： US07518861B2公开(公告)日： 2009-04-14
- 发明人: Jeffrey A. Lev , Mark S. Tracy
- 申请人： Jeffrey A. Lev , Mark S. Tracy
- 申请人地址： US TX Houston
- 专利权人： Hewlett-Packard Development Company, L.P.
- 当前专利权人： Hewlett-Packard Development Company, L.P.
- 当前专利权人地址： US TX Houston
- 主分类号： H05K7/20
- IPC分类号： H05K7/20
摘要：
A device cooling system comprises a heat pipe disposed in a device, the heat pipe having a condenser portion and at least two divergent evaporator portions, the at least two evaporator portions coupled to at least one heat-generating component of the device.
公开/授权文献
- US20080259557A1 Device cooling system 公开/授权日：2008-10-23