Invention Grant
US07518873B2 Heat spreader, semiconductor package module and memory module having the heat spreader
有权
散热器,半导体封装模块和具有散热器的存储模块
- Patent Title: Heat spreader, semiconductor package module and memory module having the heat spreader
- Patent Title (中): 散热器,半导体封装模块和具有散热器的存储模块
-
Application No.: US11481179Application Date: 2006-07-06
-
Publication No.: US07518873B2Publication Date: 2009-04-14
- Inventor: Chang-Yong Park , Hyun-Jong Oh , Yong-Hyun Kim , Dong-Woo Shin , Kyung-Du Kim , Dong-Chun Lee , Kwang-Ho Chun
- Applicant: Chang-Yong Park , Hyun-Jong Oh , Yong-Hyun Kim , Dong-Woo Shin , Kyung-Du Kim , Dong-Chun Lee , Kwang-Ho Chun
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce
- Priority: KR10-2005-0061309 20050707
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H01L23/34 ; F28F7/00

Abstract:
A heat spreader includes a heat sinking plate and a pressure clip. The heat sinking plate radiates the heat away from a heat source. The pressure clip fixes the heat sinking plate to the heat source. The pressure clip includes a spine (pressing part), one or more ribs and hook parts. The spine is arranged on the heat sinking plate. The one or more ribs extend from the spine and contact the heat source. The hook parts extend from the spine and are supported by the heat source. The pressure clip further includes mounting parts that couple the spine to the hook parts. A bending space is formed between the spine and the heat sinking plate. The heat spreader may be attached to a printed circuit board (PCB) with, e.g., a one-touch method, so that assembling processes of the memory module may be automated.
Public/Granted literature
- US20070008703A1 Heat spreader, semiconductor package module and memory module having the heat spreader Public/Granted day:2007-01-11
Information query