发明授权
- 专利标题: Circuit module
- 专利标题(中): 电路模块
-
申请号: US10585573申请日: 2005-02-04
-
公开(公告)号: US07518882B2公开(公告)日: 2009-04-14
- 发明人: Toshiki Shimizu , Kouichi Takagi , Fumiaki Mizuno
- 申请人: Toshiki Shimizu , Kouichi Takagi , Fumiaki Mizuno
- 申请人地址: JP Mie JP Mie
- 专利权人: Autonetworks Technologies, Ltd.,Sumitomo Wiring Systems, Ltd.
- 当前专利权人: Autonetworks Technologies, Ltd.,Sumitomo Wiring Systems, Ltd.
- 当前专利权人地址: JP Mie JP Mie
- 代理机构: Oliff & Berridge, PLC
- 优先权: JP2004-030761 20040206
- 国际申请: PCT/JP2005/001672 WO 20050204
- 国际公布: WO2005/076676 WO 20050818
- 主分类号: H01R9/00
- IPC分类号: H01R9/00
摘要:
In respect to an electrical connection between a control circuit board 20 and bus bars 14 interbonded together, it is an object to enhance stability in quality and reliability in connection. As a solution for achieving the object, the control circuit board 20 is provided with a conductor segment 26 to be electrically connected to a specific one of the bus bars 14 on the opposite side of a rear surface thereof bonded to the bus bars 14, and a through-hole 24 penetrating a main body thereof at a position adjacent to the conductor segment 26 so as to expose the specific bus bar 14 therethrough. Further, an electrically-connecting member 70 is disposed to bridge over the through-hole 24 and the conductor segment 26, and soldered onto the conductor segment 26 and the bus bar portion located in the through-hole 24.
公开/授权文献
- US20080080151A1 Circuit Module 公开/授权日:2008-04-03
信息查询