发明授权
- 专利标题: Thermal sensing method and apparatus using existing ESD devices
- 专利标题(中): 使用现有ESD器件的热感测方法和设备
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申请号: US11242675申请日: 2005-10-04
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公开(公告)号: US07519498B2公开(公告)日: 2009-04-14
- 发明人: David W. Boerstler , Eskinder Hailu , Kazuhiko Miki , Jieming Qi
- 申请人: David W. Boerstler , Eskinder Hailu , Kazuhiko Miki , Jieming Qi
- 申请人地址: US NY Armonk
- 专利权人: International Business Machines Corporation
- 当前专利权人: International Business Machines Corporation
- 当前专利权人地址: US NY Armonk
- 代理商 Stephen J. Walder, Jr.; Matthew B. Talois
- 主分类号: G06F3/00
- IPC分类号: G06F3/00
摘要:
The present invention provides a method, an apparatus, and a computer program product for measuring the temperature of a microprocessor through the use of ESD circuitry. The present invention uses diodes and an I/O pad within ESD circuits to determine the temperature at the location of the ESD circuitry. First, a current measuring device connects to a diode. A user or a computer program disables the protected component or circuitry, and subsequently applies a predetermined voltage to the I/O pad. This creates a reverse saturation current through the diode, which is measured by the current measuring device. From this current the user or a computer program determines the temperature of the microprocessor at the diode through the use of a graphical representation of diode reverse saturation current and corresponding temperature.