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发明授权
US07521788B2 Semiconductor module with conductive element between chip packages 有权
具有芯片封装之间导电元件的半导体模块

Semiconductor module with conductive element between chip packages
摘要：
A semiconductor module and a method of manufacturing a semiconductor module including at least one chip package, at least one module board, at least one conductive element provided between the first chip package and the module board and a protector for applying pressure to the conductive element, the module board, and the first chip package and/or acting as a heat sink for the first chip package.
摘要（中）：

一种半导体模块和半导体模块的制造方法，所述半导体模块包括至少一个芯片封装，至少一个模块板，设置在所述第一芯片封装和所述模块板之间的至少一个导电元件和用于向所述导电元件施加压力的保护器， 模块板和第一芯片封装和/或用作第一芯片封装的散热器。

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