发明授权
- 专利标题： Accessible chip stack and process of manufacturing thereof
- 专利标题（中）： 无障碍芯片堆栈及其制造工艺
-
申请号： US11266456申请日： 2005-11-03
-
公开(公告)号： US07528494B2公开(公告)日： 2009-05-05
- 发明人: Toshiharu Furukawa , Mark C. Hakey , Steven J. Holmes , David V. Horak , Charles W. Koburger, III
- 申请人： Toshiharu Furukawa , Mark C. Hakey , Steven J. Holmes , David V. Horak , Charles W. Koburger, III
- 申请人地址： US NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： US NY Armonk
- 代理机构： Scully, Scott, Murphy & Presser, P.C.
- 代理商 Joseph Petrokaitis, Esq.
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L23/52 ; H01L29/40 ; H01L21/00 ; H01L21/4763
摘要：
A process of manufacturing a three-dimensional integrated circuit chip or wafer assembly and, more particularly, a processing of chips while arranged on a wafer prior to orienting the chips into stacks. Also disclosed is the manufacture of the three-dimensional integrated circuit wherein the chip density can be very high and processed while the wafers are still intact and generally of planar constructions.