An apparatus and method for bonding polymeric materials is provided. The apparatus and method both utilize ferromagnetic materials in association with the polymeric materials to be bonded together. The polymeric materials, and the ferromagnetic material, are placed within a magnetic field, which causes hysterisis losses in the magnetic field, and thus elevation in the temperature of both the ferromagnetic material and the polymeric materials to the point where the polymeric materials melt and fuse together. The ferromagnetic materials only rise in temperature to their Curie temperatures, at which point the hysterisis losses cease, and the polymeric material stops being heated. Removing the electromagnetic field allows for cooling and fusing. An interface composition may also be placed between the two polymeric materials to be bonded.