A component for a vacuum apparatus for use in a plasma processing apparatus or a film forming apparatus for a semiconductor or the like, in which a surface is covered with a ceramic and/or metallic thermal spray film and projection-shaped particles of a width of 10-300 μm, a height of 4-600 μm and an average height/width ratio of 0.4 or higher are present within a range of 20-20,000 particle/mm2 on the surface of the thermal spray film. The thermal spray film has a porosity of 10-40%, shows a high adhering property to a film-shaped substance, is free from a product contamination by particles generated by a peeling of the film-shaped substance and can be continuously used over a prolonged period.