- 专利标题: Semiconductor device and method of fabricating the same
-
申请号: US11270615申请日: 2005-11-10
-
公开(公告)号: US07531863B2公开(公告)日: 2009-05-12
- 发明人: Yoshihisa Nagano , Yasuhiro Uemoto
- 申请人: Yoshihisa Nagano , Yasuhiro Uemoto
- 申请人地址: JP Osaka
- 专利权人: Matsushita Electric Industrial Co., Ltd.
- 当前专利权人: Matsushita Electric Industrial Co., Ltd.
- 当前专利权人地址: JP Osaka
- 代理机构: Nixon Peabody LLP
- 代理商 Jeffrey L. Costellia
- 优先权: JP11-146103 19990526
- 主分类号: H01L27/108
- IPC分类号: H01L27/108
摘要:
A protective insulating film is deposited over first and second field-effect transistors formed on a semiconductor substrate. A capacitor composed of a capacitor lower electrode, a capacitor insulating film composed of an insulating metal oxide film, and a capacitor upper electrode is formed on the protective insulating film. A first contact plug formed in the protective insulating film provides a direct connection between the capacitor lower electrode and an impurity diffusion layer of the first field-effect transistor. A second contact plug formed in the protective insulating film provides a direct connection between the capacitor upper electrode and an impurity diffusion layer of the second field-effect transistor.
公开/授权文献
- US20060065918A1 Semiconductor device and method of fabricating the same 公开/授权日:2006-03-30
信息查询
IPC分类: