Invention Grant
- Patent Title: Heat dissipation device
- Patent Title (中): 散热装置
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Application No.: US11564269Application Date: 2006-11-28
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Publication No.: US07532472B2Publication Date: 2009-05-12
- Inventor: Yu-Chen Lin , Hong-Bo Xu
- Applicant: Yu-Chen Lin , Hong-Bo Xu
- Applicant Address: CN Shenzhen, Guangdong Province TW Tu-Cheng, Taipei Hsien
- Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Shenzhen, Guangdong Province TW Tu-Cheng, Taipei Hsien
- Agent Frank R. Niranjan
- Priority: CN200610060295 20060414
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H01L23/36
Abstract:
A heat dissipation device (100) comprises a heat sink (10) and a fan (40) mounted on the heat sink (10). The heat sink (10) comprises a central core (12), a plurality of branches (122) radially extending outwardly from a periphery of the core (12) and a plurality of fins (14) extending from of the core (12) and the branches (122). The fan (40) comprises a plurality of blades (404). The branches (122) and the fins (14) extend and are oriented in a direction opposite to a rotation direction of the blades (404) of the fan (40).
Public/Granted literature
- US20070242433A1 HEAT DISSIPATION DEVICE Public/Granted day:2007-10-18
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