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发明授权
US07538419B2 Stacked-type chip package structure 有权
堆叠式芯片封装结构

Stacked-type chip package structure
摘要：
A stacked-type chip package structure including a substrate, a first chip, bonding wires, a second chip and B-stage conductive bumps is provided. The first chip is disposed on the substrate, and it has first bonding pads disposed on an active surface thereof. Besides, the first bonding pads are electrically connected to the substrate through the bonding wires. The second chip is disposed above the first chip, and it has second bonding pads disposed on an active surface thereof. The second bonding pads of the second chip are electrically connected to the first bonding pads of the first chip through the B-stage conductive bumps respectively, and each B-stage conductive bump covers a portion of the corresponding bonding wire.
摘要（中）：

提供了包括基板，第一芯片，接合线，第二芯片和B级导电凸块的堆叠型芯片封装结构。 第一芯片设置在基板上，并且其第一接合焊盘设置在其有效表面上。 此外，第一接合焊盘通过接合线电连接到基板。 第二芯片设置在第一芯片上方，并且其第二焊盘设置在其活性表面上。 第二芯片的第二焊盘分别通过B级导电凸块电连接到第一芯片的第一焊盘，并且每个B级导电凸块覆盖相应接合线的一部分。

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