Invention Grant
- Patent Title: Dielectric film production process and capacitor
- Patent Title (中): 介质膜生产工艺及电容器
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Application No.: US11492943Application Date: 2006-07-26
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Publication No.: US07539005B2Publication Date: 2009-05-26
- Inventor: Kiyoshi Uchida , Kenji Horino , Hitoshi Saita
- Applicant: Kiyoshi Uchida , Kenji Horino , Hitoshi Saita
- Applicant Address: JP Tokyo
- Assignee: TDK Corporation
- Current Assignee: TDK Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oliff & Berridge, PLC
- Priority: JPP2005-221676 20050729
- Main IPC: H01G4/06
- IPC: H01G4/06 ; H01G4/005

Abstract:
A capacitor provided with a dielectric film, and a first electrode and second electrode formed sandwiching it and facing each other, wherein the dielectric film has a density exceeding 72% of the theoretical density calculated based on the lattice constant, and either or both of said first electrode and said second electrode contain at least one metal selected from the group consisting of Cu, Ni, Al, stainless steel and a nickel-based alloy.
Public/Granted literature
- US20070025059A1 Dielectric film production process and capacitor Public/Granted day:2007-02-01
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