A switch pin for SMD manufacturing processes to be mounted onto a circuit board includes a connection end located in a switch housing and a coupling end extended from the connection end and exposed outside the switch housing. The coupling end has a horizontal portion and a bend portion bending from the horizontal end towards the switch housing. Hence the signal pin and the circuit board can form a greater electric connection area to enhance electric effect. The bend portion also can prevent interference of other electronic elements installed on the circuit board.