Invention Grant
US07542297B2 Optimized mounting area circuit module system and method 有权
优化安装区电路模块系统及方法

Optimized mounting area circuit module system and method
Abstract:
A flexible circuitry is populated with integrated circuitry (ICs) disposed along one or both of its major sides. Contacts are distributed along the flexible circuitry to provide connection between the module and an application environment. A rigid substrate is configured to provide space on one side where the populated flex is disposed while in some embodiments, heat management or cooling structures are arranged on one side of the module to mitigate thermal accumulation in the module.
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