Invention Grant
- Patent Title: Optimized mounting area circuit module system and method
- Patent Title (中): 优化安装区电路模块系统及方法
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Application No.: US11255061Application Date: 2005-10-19
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Publication No.: US07542297B2Publication Date: 2009-06-02
- Inventor: James Douglas Wehrly, Jr. , Mark Wolfe , Paul Goodwin
- Applicant: James Douglas Wehrly, Jr. , Mark Wolfe , Paul Goodwin
- Applicant Address: US TX Austin
- Assignee: Entorian Technologies, LP
- Current Assignee: Entorian Technologies, LP
- Current Assignee Address: US TX Austin
- Agency: Fish & Richardson P.C.
- Main IPC: H05K1/00
- IPC: H05K1/00

Abstract:
A flexible circuitry is populated with integrated circuitry (ICs) disposed along one or both of its major sides. Contacts are distributed along the flexible circuitry to provide connection between the module and an application environment. A rigid substrate is configured to provide space on one side where the populated flex is disposed while in some embodiments, heat management or cooling structures are arranged on one side of the module to mitigate thermal accumulation in the module.
Public/Granted literature
- US20060050489A1 Optimized mounting area circuit module system and method Public/Granted day:2006-03-09
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