Invention Grant
- Patent Title: Type of loop heat conducting device
- Patent Title (中): 环路导热装置类型
-
Application No.: US11416031Application Date: 2006-05-02
-
Publication No.: US07543629B2Publication Date: 2009-06-09
- Inventor: Chi-Te Chin , Chih-Sheng Wang , Tang-Hung Tu
- Applicant: Chi-Te Chin , Chih-Sheng Wang , Tang-Hung Tu
- Applicant Address: TW Yangmei
- Assignee: Yeh-Chiang Technology Corp.
- Current Assignee: Yeh-Chiang Technology Corp.
- Current Assignee Address: TW Yangmei
- Agency: Bucknam and Archer
- Priority: TW95104867A 20060214
- Main IPC: F28D15/00
- IPC: F28D15/00 ; H05K7/20

Abstract:
This invention relates to a type of loop heat conducting device, comprising an evaporator and a condenser which are connected together by means of a loop pipe, in order to form a cyclic loop for a liquid working medium, wherein the evaporator has a wick network core, and multiple tunnels are formed on the wick network core, and one end of the tunnels converges at a vapor chamber and is connected to a loop pipe to form a gaseous working medium outlet, and the terminal end of the pipe extends into and comes into contact with the internal part of the wick network core, and a compensation chamber for liquid working medium is formed on the upper section of the wick network core. Consequently, the cyclic loop that separates the gas and liquid enables the optimal heat dissipation capacity, and also has a structure that is simplified, thereby allowing for easy mass production.
Public/Granted literature
- US20070187072A1 Type of loop heat conducting device Public/Granted day:2007-08-16
Information query