发明授权
- 专利标题： Electronic device interconnect system
- 专利标题（中）： 电子设备互连系统
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申请号： US11413347申请日： 2006-04-28
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公开(公告)号： US07544087B2公开(公告)日： 2009-06-09
- 发明人: Steven S. Homer , Earl W. Moore , Hugh D. Waddell
- 申请人： Steven S. Homer , Earl W. Moore , Hugh D. Waddell
- 申请人地址： US TX Houston
- 专利权人： Hewlett-Packard Development Company, L.P.
- 当前专利权人： Hewlett-Packard Development Company, L.P.
- 当前专利权人地址： US TX Houston
- 主分类号： H01R12/24
- IPC分类号： H01R12/24
摘要：
An electronic device interconnect system includes a connector member includes a plurality of connector pins configured to be communicatively coupled to a plurality of respective contact pads of a cable, at least one of the plurality of connector pins having a plurality of spaced apart connector elements, each of the connector elements configured to engage the respective contact pad corresponding to its connector pin.
公开/授权文献
- US20070254523A1 Electronic device interconnect system 公开/授权日：2007-11-01