发明授权
US07544274B2 Plating device and plating method 有权
电镀装置及电镀方法

Plating device and plating method
摘要:
There is provided a plating method and device having a fixed drum (20) in which an anode (21) is exposed on the external peripheral surface; a rotating drum provided on the external periphery of the fixed drum, onto which a workpiece W transported in the longitudinal direction is wound; an annular opening (35) formed at the bottom of the rotating drum and provided so as to penetrate from the external periphery of the rotating drum to the internal periphery continuously in the peripheral direction of the rotating drum; a plating solution feeding channel (22) that leads into the fixed drum and is formed in a position on the external periphery of the fixed drum corresponding to the angle position (52a) of the prescribed arc of contact of the rotating drum onto which the workpiece is wound; a plating device for feeding the plating solution to the flow channel using the tunnel-shaped space (52) enclosed by the workpiece wound on the external periphery of the rotating drum, the peripheral wall of the annular opening, and the external periphery of the fixed drum as the flow channel.
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