发明授权
- 专利标题: Plating device and plating method
- 专利标题(中): 电镀装置及电镀方法
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申请号: US11316922申请日: 2005-12-27
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公开(公告)号: US07544274B2公开(公告)日: 2009-06-09
- 发明人: Hiroshi Miyazawa , Terumasa Inao
- 申请人: Hiroshi Miyazawa , Terumasa Inao
- 申请人地址: JP Tokyo
- 专利权人: Dowa Metaltech Co., Ltd.
- 当前专利权人: Dowa Metaltech Co., Ltd.
- 当前专利权人地址: JP Tokyo
- 代理机构: Oliff & Berridge, PLC
- 优先权: JP2004-376955 20041227
- 主分类号: C25D13/00
- IPC分类号: C25D13/00
摘要:
There is provided a plating method and device having a fixed drum (20) in which an anode (21) is exposed on the external peripheral surface; a rotating drum provided on the external periphery of the fixed drum, onto which a workpiece W transported in the longitudinal direction is wound; an annular opening (35) formed at the bottom of the rotating drum and provided so as to penetrate from the external periphery of the rotating drum to the internal periphery continuously in the peripheral direction of the rotating drum; a plating solution feeding channel (22) that leads into the fixed drum and is formed in a position on the external periphery of the fixed drum corresponding to the angle position (52a) of the prescribed arc of contact of the rotating drum onto which the workpiece is wound; a plating device for feeding the plating solution to the flow channel using the tunnel-shaped space (52) enclosed by the workpiece wound on the external periphery of the rotating drum, the peripheral wall of the annular opening, and the external periphery of the fixed drum as the flow channel.
公开/授权文献
- US20060137987A1 Plating device and plating method 公开/授权日:2006-06-29
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