发明授权
- 专利标题： Defect identification system and method for repairing killer defects in semiconductor devices
- 专利标题（中）： 缺陷识别系统和修复半导体器件杀伤性缺陷的方法
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申请号： US11519614申请日： 2006-09-12
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公开(公告)号： US07547560B2公开(公告)日： 2009-06-16
- 发明人: Oliver Desmond Patterson , David M. Shuttleworth , Bradley J. Albers , Werner Weck , Gregory Brown
- 申请人： Oliver Desmond Patterson , David M. Shuttleworth , Bradley J. Albers , Werner Weck , Gregory Brown
- 申请人地址： US PA Allentown
- 专利权人： Agere Systems Inc.
- 当前专利权人： Agere Systems Inc.
- 当前专利权人地址： US PA Allentown
- 主分类号： H01L21/00
- IPC分类号： H01L21/00
摘要：
A method for improving semiconductor yield by in-line repair of defects during manufacturing comprises inspecting dies on a wafer after a selected layer is formed on the dies, identifying defects in each of the dies, classifying the identified defects as killer or non-critical, for each killer defect determining an action to correct the defect, repairing the defect and returning the wafer to a next process step. Also disclosed is a method for determining an efficient repair process by dividing the die into a grid and using analysis of the grid to find a least invasive repair.